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SMA6F
High junction temperature TransilTM
Features

Halogen-free package Peak pulse power: - 600 W (10/1000 s) - 4 kW (8/20 s) Stand off voltage: 5, 12 or 13 V Unidirectional type Low clamping voltage versus standard series Low leakage current, 0.2 A at 25 C Operating Tj max: 175 C JEDEC registered package outline
K
Unidirectional

A
SMAflat
Complies with the following standards
IEC 61000-4-2 level 4: - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883G-Method 3015-7: class3B - 25 kV (human body model)
Description
The SMA6F Transil series has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 and 5. They are generally for surges below 600 W 10/1000 s. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provides a better safety margin to protect sensitive circuits with extended life time expectancy. Packaged in SMAflat non exposed pad, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard).
TM: Transil is a trademark of STMicroelectronics
September 2008
Rev 1
1/9
www.st.com 9
Characteristics
SMA6F
1
Table 1.
Symbol PPP P IFSM Tstg Tj TL
Characteristics
Absolute ratings (Tamb = 25 C)
Parameter Peak pulse power dissipation (1) Power dissipation on infinite heatsink Non repetitive surge peak forward current for unidirectional types Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10 s Tj initial = Tamb Tlead = 55 C tp = 10 ms Tj initial = Tamb Value 600 6 60 -65 to +175 -55 to +175 260 Unit W W A C C C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Symbol Rth (j-l)
Thermal resistance
Parameter Junction to leads Value 20 Unit C/W
Table 3.
Symbol VRM VBR VCL IRM IPP T VF RD
Electrical characteristics - definitions (Tamb = 25 C)
Parameter Stand-off voltage
IF I
Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance
IPP VCL VBR VRM IRM IR VF V
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SMA6F Table 4. Electrical characteristics - values (Tamb = 25 C)
IRM max@VRM Type 25 C 85 C A (Max) SMA6F5.0A SMA6F12AVCL SMA6F13A 10 0.2 0.2 50 1 1 V min VBR @IR(1) typ max V mA
Characteristics
VCL @IPP RD(2) VCL @IPP RD(2) 10/1000 s 10/1000 s 8/20 s 8/20 s max V 9.2 18.5 20.4 A 68 31 29 0.029 0.135 0.154 max V A 0.021 0.055 0.054
T(3) max 10-4/C 5.7 7.8 8.3
5.0 6.40 6.74 7.07 10 12 13.2 13.7 14.3 13 14.4 15.2 15.9 1 1
13.4 298 22.9 157 23.9 147
1. Pulse test: tp <50ms. 2. To calculate maximum clamping voltage at other surge currents, use the following formula VCLmax = RD x IPP + VBRmax 3. To calculate VBR versus junction temperature, use the following formula: VBR @ Tj = VBR @ 25 C x (1 + T x (Tj - 25))
Figure 1.
Definition of Ipp pulse
%IPP 100
Repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s)
50
0 tr tp
t
Figure 2.
Relative peak power dissipation versus initial junction temperature
Figure 3.
Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
PPP[T j initial] / PPP[T j initial=25C]
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 175 200 Tj initial (C)
PPP(kW)
100.0
Tj initial = 25 C
10.0
1.0
tp(ms)
0.1 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
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Characteristics Figure 4. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
SMA6F
1000.0
IPP(A)
Tj initial=25 C SMA6F5.0A SMA6F12AVCL
100.0
SMA6F13A
10.0
1.0
tp = 8/20 s tp = 10/1000 s
VCL(V)
0.1 5 10 15 20 25
Figure 5.
Junction capacitance versus reverse applied voltage (typical values)
10000
C(pF)
F=1 MHz VOSC=30 mVRMS Tj=25 C
SMA6F5.0A
1000
SMA6F12AVCL SMA6F13A
VR(V)
100 1 10 100
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SMA6F
Characteristics
Figure 6.
Peak forward voltage drop versus peak forward current (typical values)
Figure 7.
Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm2)
IFM(A)
1.0E+02
1.00
Zth(j-a)/Rth(j-a)
On recommended pad layout
1.0E+01
0.10
1.0E+00
Tj =125 C
Tj =25 C
0.01
1.0E-01
VFM(V)
1.0E-02 0.0 0.5 1.0 1.5 2.0
0.00 1.0E-03 1.0E-02 1.0E-01
tp(S)
1.0E+00 1.0E+01 1.0E+02 1.0E+03
Figure 8.
Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, copper thickness = 35 m)
Figure 9.
Leakage current versus junction temperature (typical values)
Rth(j-a)(C/W)
200 180 160 140 120 100 80 60 40 20 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
1.E+04
IR(nA)
1.E+03
VBR=11.7V
1.E+02
VBR>11.7V
1.E+01
SCU(cm2)
1.E+00 25 50 75
Tj(C)
100 125 150
VR=VRM
175
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Ordering information scheme
SMA6F
2
Ordering information scheme
Figure 10. Ordering information scheme
SM
Surface Mount Package A = SMAflat package Surge rating 6F = 600 W Stand off voltage example: 5.0 = 5.0 V Type A = Unidirectional Delivery mode TR = Tape and reel
A 6F
xx
A
-
TR
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SMA6F
Package information
3
Package information

Case: JEDEC DO-221AC molded plastic over Planar junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Band indicates cathode Flammability: Epoxy rated UL94V-0 RoHS package
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5. SMAflat (non exposed pad) dimensions
Dimensions Ref.
A c D L 2x L1 2x E E1 L L2 2x b
Millimeters Min. Typ. Max. Min. 0.035 0.049 0.006 0.088 0.189 0.156 0.030
Inches Typ. Max. 0.043 0.065 0.016 0.116 0.220 0.181 0.059 0.019 0.019
A b c D E E1 L L1 L2
0.90 1.25 0.15 2.25 4.80 3.95 0.75 0.50 0.50
1.10 1.65 0.40 2.95 5.60 4.60 1.50
Figure 11. SMAflat footprint dimensions Figure 12. Marking information
5.52 (0.217)
Cathode bar (unidirectional devices only )
1.52 (0.060)
e3
xxx z y ww
1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeters (inches)
e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week
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Ordering information
SMA6F
4
Ordering information
Table 6. Ordering information
Marking SUA SUJ SUG SMAflat 0.035 g 10000 Tape and reel Package Weight Base qty Delivery mode
Order code SMA6F5.0A-TR SMA6F12AVCL-TR SMA6F13A-TR
5
Revision history
Table 7.
Date 04-Sep-2008
Document revision history
Revision 1 First issue. Changes
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SMA6F
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